HETEROGENEOUS INTEGRATION

Nanotechnology pushes the frontiers of sensor technology!

Future trends in semiconductor and sensor technology foresee the assembly and integration of devices at multiple levels, ranging from nano- to micro- and macroscale. The nanoscale provides enhanced performance, the microscale implements various material platforms to achieve a broad range of functionalities, and the macroscale enables interaction with the real world.

Heterogeneous Integration (HI) is the formula to bridge the gap between the nanoscale with its great variety of materials and novel properties, and systems that humans can interact with.

The objective of HI is the „More than Moore” integration of different functionalities ranging from sensors and signal processors to photonics or energy into a single package.

The challenge of HI is the implementation of components with basically incompatible manufacturing technology into a single device.

The key to HI is the combination of an increasingly wider set of expertise, ranging from microelectronics, sensors & actuators to the bio-nano convergence domain.

SESSIONS

HETEROGENEOUS INTEGRATION

Heterogeneous Integration implements multifunctional components based on different technologies and materials into a single package. Heterogeneous Integration includes nano-, bio-, and biomimetic technologies and closes the gap between the world of nanodevices and systems that humans can interact with.

NANOSENSORS FOR BIOMEDICAL AND ENVIRONMENTAL APPLICATIONS

Nanosensors are smaller, more sensitive, demand less power, and react faster than their macroscopic counterparts. The heterogeneous integration of nanosensors opens the door to new biomedical and environmental applications.

FUNCTIONAL LAYERED SYSTEMS

Complex layered systems add more functionality and increase performance in a large variety of industrial applications. Functiona l layered systems are based on novel alternative materials and processes which have to be adapted to standard semiconductor technology.

3D-SYSTEM INTEGRATION

Compatibility with today’s silicon technology is presently the key for the acceptance and realization in specialized microelectronic fabs. 3D-systems, can integrate heterogeneous components such as functional layers, sensors & actuators, "μ"-fluidics & "μ"-pumps, optical interconnects, heating systems, and nano-objects.

Speakers of NANOSENS 2010:

III-V Nanowires and their Potential for Integration with Silicon

Lars Samuelson, Nanometer Structure Consortium, Lund University, Sweden

Nano- & Heterogeneous Integration Technologies for Chemical Sensing

Maximilian Fleischer, Siemens AG – Corporate Research & Technology, Munich, Germany

A Nanoscale Artificial Nose for Screening and Diagnosing Disease by Breath Testing

Hossam Haick, Technion – Israel Institute of Technology, Israel

Biosensoric Applications of Metal Nanoparticles

Wolfgang Fritzsche, Institute of Photonic Technology IPHT, Jena, Germany

Spintronic platforms for biological and biomedical applications

Paulo J.P. de Freitas (invited), INESC Microsistemas e Nanotecnologias INESC, Portugal

Nanosystems for Biomedical Applications

Gerald Urban, IMTEK – Institute for Mikrosystem Technology, University of Freiburg, Germany

Integrated MEMS Solutions for Biomedical Applications

Hoc Khiem Trieu, Fraunhofer Institute of Microelectronic Circuits and Systems IMS, Duisburg, Germany

Opportunities for 3D IC and Sensor Integration

Martin Schrems, austriamicrosystems AG, Austria

Accepted Contributors – Papers are still accepted:

Integrated Optical Sensor Array based on ring-shaped Organic Photodiodes and organic LEDs

Tobias Abel, Graz University of Technology, Austria

Functional Chip Surfaces in a Diagnostic Test System for Cancer Screening

Ursula Sauer, Austrian Institute of Technology GmbH, Austria

An in-line Probe Integrating Infrared Spectroscopy and ultrasonic Manipulation of Cells

Stefan Radel, Vienna University of Technology, Austria

FIB-Nanotomography of Biological Cell Tissue and Investigation of Interfaces between Tissue and Biocompatible Materials

Peter Gnauck, Carl Zeiss NTS GmbH, Oberkochen, Germany

Biomaterials and Scaffolds for Advanced Therapies in the Regeneration of Connective Tissues

Nuno M. Neves, 3B´s Research Group, University of Minho, Portugal

Self-Consistent 3D Simulations of BioFETs

Stefan Baumgartner, Wolfgang Pauli Institut, Universität Wien, Austria

Transparent Conductive Oxide Nanoparticle Functionalization for Surface Plasmon Resonance Sensors

Jovan Matovic, Vienna University of Technology, ISAS – Institute for Sensors and Actuators Systems, Austria

Detection of Neutral Nanoparticles using a Superconducting Wire

Markus Marksteiner, University of Vienna, Quantum & Nanophysics, Austria

Measurement and Monitoring System for Forming Processes based on Piezoresistive Thin Film Systems

Saskia Biehl, Fraunhofer-Institute for Surface Engineering and Thin Films, Braunschweig, Germany

ENIAC-Austria Platform

Johann Massoner, Infineon Technologies Austria AG, Austria

Lithography and Wafer Bonding Solutions for 3D Integration

Thorsten Matthias, EV Group, Austria

Calibrated Nanoscale Measurements using a Scanning Microwave Microscope

Hans-Peter Huber, University of Linz, Christian Doppler Laboratory, Austria

Take Advantage of your 50/50 Chance for Subsidies in the Research Support in Austria

Matthias Bruck, ABA – Austrian Business Agency, Vienna, Austria

CONTACT

Conference-Office:
AIT Austrian Institute of Technology GmbH, Nano Systems
Ms. Kerstin Formanek
Phone: +43 0 50550-4300
Email: office@nanosens.at

www.nanosens.at